Numerical study of natural convection in an enclosure with discrete heat sources on one of its vertical walls

In this study, natural convection in a fluid-filled rectangular enclosure is analyzed using COMSOL? commercial software. The fluid which takes place dielectric liquid called FC-75. Attached to one of the vertical walls an array protrusions, each representing computer chips mounted on printed circuit board. nominal power consumed by chip assumed be 0.35, 1.07, 1.65, and 2.35 W. This corresponds exactly values used experiments, were performed once author study. results experiment numerical study are shown as Nusselt numbers vs. Rayleigh numbers, both being most important dimensionless parameters convection. A comparison has that COM-SOL? can achieve reliable similar problems, eliminating need build expensive experimental set-ups spending time conducting experiments. simulation aimed designs electronic circuits confined spaces.